Data centers consumed 4.4% of US electricity in 2023 and is estimated to be used up to 12% to 2028. The majority of the absorbed energy data centers are used to help transfer data from chips to chips. A company called Hyperlume is trying to make this process more energy efficient while also accelerating them.
Ottawa, based in Canada Hyperlume created a version of microfibers that can carry information faster than copper -based connections usually located between shelves in the data centers. These microleds also require less energy to transfer data from copper cables.
Hyperlume co -founder and CEO Mohsen Asad told Techcrunch that the company was a “rational expansion” of the project he and his co -founder Hossein Fariborzi before the establishment of the company. Asad’s background in electrical engineers led him to a career focused on finding ways to transfer data between chips and between shelves. Fariborzi has an expertise in the design of low power electric circuit.
“I worked on microleds, I was working on data transfer and this AI explosion and the requirements for sending chips to chips, energy consumption – all things met naturally,” Asad said. “We found a huge opportunity in the market.”
Energy consumption and delay have always been problems for communicating with chips in database centers, Asad said, but they have worsened by the rise rate-and the rate of AI. Solving the latent situation or data delay will not only accelerate existing connections between chips, but also to unlock the chip capacity that was not previously accessible due to the latent status concentration points, ASAD added.
‘If we can solve this issue of delay practically, we do [chips] Work faster together, “Asad said.” When you have large linguistic models […] You need chips to communicate with almost zero latent condition. ”
When Asad and Fariborzi started Hyperlume in 2022, they began to think about how to deal with the latent data status problem using existing technology. Silicon was a possible option for connecting chips, but very expensive to scale use. The lasers were similar-prominent.
Thus, Hyperlume was installed in taking cheap microspheres and modernization to transfer information from chips to chips very quickly, almost imitating what a fiber optic connection could do at no cost.
“The secret sauce is extremely fast microscopy and on the other hand a low ASIC force that drives everything and communicates with other brands,” Asad said.
Hyperlume works with an early handful of early customers-most in North America-for the time being, while finishing its product. The company has received many incoming interests, especially from supervisors, ASAD said, in addition to cable manufacturers and businesses in other industries that could benefit from technology.
“The first stage for us is to work with these first adopters – as soon as the technology is proven and enters the data centers with these first adopters, it will give us the opportunity to scale to work with the rest of the market,” the Asad. “Demand is there and increasing and increasing every year.”
Hyperlume recently increased a $ 12.5 million seed round, led by BDC Capital’s Deep Tech Venture Fund and Arctern Ventures with the participation of Muus Climate Partners, Intel Capital and SOSV, among other supporters.
The new chapter will be used to hire more engineers and create the funds needed to continue developing Hyperlume technology so that it can soon land in the hands of more customers. In the future, the company wants to increase its bandwidth so that it is technologically ready for the next generation of powerful data centers.
“We are currently focusing on visual connections, connecting the chips together, connect the boards together, but the way we see the business grow is that it is going to be a AI connectivity solution provider,” Asad said.
